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OEM Only

OEM products are designed for OEMs with ongoing and consistent order requirements and subject to minimum order quantities. Evaluation units are available without such restrictions. BCM has multiple stocking distributors that may be able to work with OEMs to streamline product deliveries. Please contact BCMSales@bcmcom.com Sales for more information.

COM Express Modules (COMe)

COM Express Module, computer-on-module (COM), is a very compact and highly integrated embedded computer module that works with compatible carrier board with I/O interfaces, memory, storage, connectors or form factors. Separating the design of the carrier board and COMe module makes design concepts more modular, cost effective and faster time-to-market solution.

COMe module provides many features required by various industry or applications needing high performance combined with specialized computing requirements not available off-the-shelf. It is an ideal solution for hosting embedded edge computing nodes, high-performance medical devices incorporating unique custom IP on the custom carrier board, casino gaming applications with customized gaming circuitry, or any high-end computing application that requires unique customization or feature requirements that can quickly be designed onto a carrier board that hosts the COM Express module versus a more lengthy ground up design on a single board platform. Target market for this type of high-performance, high customization/specialization, and quick time to market product include Medical devices, AI & Automation applications, AI in Transportation applications, Casino Gaming, AI in Security applications, Simulation Digital Broadcasting.

13th Gen Intel® Platform

ESM-RPL
ESM-RPL
Coming Soon

13th Gen Intel® Raptor Lake H/P/U-Series BGA Processor COMe Module

DisplayPort/HDMI/LVDS/eDP/VGA
4xUSB 3.2 Gen2, 8xUSB 2.0xSATA III, 8-bit GPIO, I2C, SPI, SMBus, 2xUART
1xGen4 PCIe x8, 2xGen4 PCIe x4, 7xGen3 PCIe x1
+9V ~ +19V

11th Gen Intel® Platform

ESM-TGH
ESM-TGH

PICMG COM R3.0 Type 6 module, 11th Gen Intel® Xeon/Core™ Processor

HDMI 2.0b, DP 1.4, LVDS, VGA
4xUSB 3.2 Gen2x1 (10 Gbps), 8xUSB 2 .0, 4xSATA III, 8-bit GPIO, I2C, SPI, SMBus, 2 x UART
1 x Gen4 PEG x16, 8 x PCIe x1
+9V ~ +19V
ESM-EHLC
ESM-EHLC

Intel® Atom™ 4-cores SoC BGA Processor Onboard

HDMI, DP, LVDS, VGA
8xUSB 2.0, 4xUSB 3.2 Gen2 x1 (10 Gbps), 2xUART, 2xSATA III
3 x Gen3 PCIe x1 (8.0 GT/s)
+9V ~ +19V. Optional Extended Temp.

9th/8th Gen Intel® Platform

ESM-CFH
ESM-CFH

Intel® Coffee Lake CM246/QM370 PICMG COM R3.0 Type 6 COMe module

Supports 3 independent, HDMI, DP, LVDS, VGA
12xUSB, 4xSATA III
PCIe x16 Gen 3, 8 x PCIe x1, 8xPCIe x1*
9V~19V, TPM 2.0

Carrier Board for COM Express (COMe) Module

EEV-EX14
EEV-EX16

Micro ATX Type6 COM Express Carrier Board PICMG® COM Express® Revision 3.0

3xHDMI, 3xDP,eDP, LVDS, VGA
8xUSB, 1xLAN, 4xSATA III, Mic-In, Line-out
1xPCIe x16, 2xPCIe x4, 1xIET
ATX

Contact us at BCMSales@bcmcom.com or give us a call 949-470-1888

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