Data-Center Power at the Edge: Next-Gen Intel® Xeon® 6 Solutions for High-Performance System Integrators & OEMs
Unlike conventional HPC platforms primarily designed for centralized data centers, our latest Edge HPC portfolio is optimized for on-site computing environments where high performance and compact reliability are mission-critical. For system integrators and OEMs building high-performance edge solutions—across industrial automation and robotics, defense and aerospace, medical imaging, intelligent surveillance, high-density gaming, and smart infrastructure—this architecture delivers unprecedented processing power directly to the field.
Through a vertically integrated dual-product strategy, BCM gives OEMs and system integrators complete design flexibility:
The Platform: HPS-GNR1U 1U HPC System
For applications requiring rapid deployment, this system features a compact 1U rackmount design that combines high-performance computing, high-density storage, and flexible GPU expansion within limited rack space. Powered by a single Intel® Xeon® 6 processor with support for up to 350W TDP, the system integrates PCIe Gen5 architecture and dual 10GbE LAN interfaces to meet the demands of high-speed data transfer and low-latency computing.
For expansion flexibility, the HPS-GNR1U supports either one double-wide FHFL GPU or two single-wide FHFL GPUs with one HHHL add-on card, without compromising critical storage bays or system connectivity. This optimized 1U design delivers a rare combination of high-density GPU computing and flexible I/O expansion. In addition, the system supports up to ten hot-swappable E1.S NVMe drives or four U.2 NVMe drives, enhancing real-time data processing and high-frequency write performance for data-intensive workloads.
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The Core: HPM-GNR1U Industrial HPC Board
For customers requiring customized development and specialized enclosure integration, this industrial-grade board, built on Intel® Xeon® 6 processors (6500P/6700P/6700E), is the ideal core computing platform. It supports DDR5 high-bandwidth memory and PCIe Gen5 technology, delivering high scalability and high-throughput computing performance.
To preserve strict Gen5 signal integrity and optimize internal airflow, the board integrates 5 x high-density MCIO 8i interfaces, natively supporting up to 10 x hot-swappable E1.S NVMe drives for data-intensive workloads. Crucially for remote and field-deployed networks, it integrates IPMI 2.0 remote management to drastically improve management efficiency and simplify deployment.
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The BCM Advantage for System Integrators & OEMs:
Our vertically integrated approach—combining both system-level and board-level solutions—enables us to address your exact integration pipeline. Customers seeking rapid deployment can adopt the complete HPS-GNR1U HPC platform, while those requiring customized development can leverage the HPM-GNR1U board for flexible design integration. This dual-product strategy strengthens our ability to support long-lifecycle, high-reliability commercial and specialized programs.
Backed by BCM's US-based engineering services and tier-one technical support, we help you transition seamlessly from complex specifications to field-deployed reality.
Explore technical specifications and download the datasheets here:
- HPS-GNR1U 1U HPC System: https://www.bcmcom.com/bcm_product_HPS-GNR1U.html
- HPM-GNR1U Industrial HPC Board: https://www.bcmcom.com/bcm_product_HPM-GNR1U.html
For more product information please contact your BCM Regional Sales Managers or contact us BCMSales@bcmcom.com. For custom design, please visit our OEM/OEM Design Services
📨 Email: BCMSales@bcmcom.com
🌐 Website: https://www.bcmcom.com