Supports 6th and 7th Gen. Intel Core i7/i5/i3 Processors
The BCM MX110HD mini-ITX motherboard supports both 6th and 7th generation Intel Core i7, i5, i3, and Celeron processors, codenamed Skylake and Kaby Lake respectively, providing customers flexibility of scalable performance.
Low Profile Design, Rich I/O Interfaces
The MX110HD motherboard is a single stack THIN mini-ITX motherboard providing powerful desktop CPU performance optimized for 4K video as well as supporting dual display. This thin-ITX design provides rich onboard and external I/O interfaces including HDMI, DisplayPort, LVDS, dual LAN ports, four USB 3.0 and four USB 2.0 ports, two COM ports, three SATA III connectors, one mini-PCIe with mSATA support and one half size mini-PCIe and PCIe x4 slots.
Thin-ITX + DC Power for Thin Kiosk/Digital Signage Applications
The MX110HD motherboard operates with DC-in power via its onboard DC-in connector at the rear I/O area. With desktop processing performance, low profile hardware platform, and DC-in power design, the BCM MX110HD mini-ITX motherboard is a competitive solution for use in thin Kiosk designs, digital signage, or 1U rackmount applications. The “THIN” mini-ITX concept is optimized to fit behind an LCD panel adding a powerful compute engine while maintaining a thin overall product profile.
The MX110HD is one of BCM’s answer to the high performance value segment. This is a cost optimized, value-performance motherboard for applications requiring the latest and greatest in performance without the overhead of enterprise features such as Intel® Active Management Technology (Intel® AMT), Intel® vPro™, or RAID. The MX110HD delivers extraordinary embedded/industrial computing value.
For more information please contact us at BCMSales@bcmcom.com or visit us at www.bcmcom.com.
Product Page: http://www.bcmcom.com/bcm_product_MX110HD.htm
Member of the Intel® Internet of Things Solutions Alliance
BCM is an associate member of Intel IoT Alliances. This membership opens a wide door for BCM to align closely with Intel® to better serve our clients in their use and adoption of Intel® embedded architecture. As an Intel® Internet of Things Solutions Alliance Associate member, BCM stays technologically connected through in receiving early access to the latest Intel® technical roadmaps, test platforms, design support, and business objectives. Additionally, our R&D engineers and account managers will be in a position to better serve our clients by further educating themselves about the latest Intel® embedded technologies and by actively participating in Intel® training, market development programs, and other ecosystem activities.