BCM introduces BC370Q, RX370Q, MX370Q and ECM-CFS industrial motherboards supporting the 8th generation Intel® processors with Q370 Chipset

BCM introduces BC370Q, RX370Q, MX370QD and ECM-CFS industrial motherboards supporting the 8th generation Intel® processors with Q370 Chipset

BCM, an associate member of Intel® Internet of Things Solutions Alliances, introduces four new Q370 series embedded industrial motherboards based on the 8th generation Intel® processor platform, codenamed Coffee Lake. These products are available in ATX (BC370Q), Micro ATX (RX370Q), mini-ITX (MX370QD), and 3.5” SBC (ECM-CFS) form factors. These four motherboards are equipped with LGA 1151 CPU socket with Intel® Q370 express chipset supporting the 8th generation Intel® Core™ (2C/4C/6C), Celeron® and Pentium® processors.

The 8th generation Intel® Core™, Pentium® and Celeron® processor are based on Intel's 14 nm technology. This processor family (Coffee Lake S) introduces the first 6-core processors (Intel® Core™ i9) for performance-demanding applications. When paired with an Intel® Q370 chipset, these processors offer even greater CPU and graphics performance as compared to previous generations and introduce native USB 3.1 Gen2 (10Gb/s) support.

BCM’s new Intel® Coffee Lake platform based industrial motherboards are ideally suited for applications like gaming, content creation, virtual reality, transactional retail terminals, digital security systems, and healthcare.

Products & Features:


	BC370Q LGA1151 Socket supports 8th Gen Intel® Core™/Pentium®/ Celeron® Processors up to 95W TDP 4 x DIMM sockets support up to 64 GB DDR4 2400 MHz system memory Optional ECC Memory Support Rich Expansion: 1 x PCIe x16, 2 x PCIe x4, 2 x PCIe x1, 2 x PCI, 2 x M.2 Supports Triple Displays 1 x HDMI, 2 x DisplayPorts, 1 x VGA 9 x USB 3.0, 8 x USB 2.0 6 x COM Ports TPM 2.0 ATX Form Factor (12" x 9.6")

	RX370Q High Reliability Gold Plating Connectors Intel® Q370 PCH Socket LGA 1151 supports 8th Generation Intel® Core™/Pentium®/ Celeron® Processors 4 x Gold Plated DIMM slots support up to 64GB Dual Channel DDR4 2400MHz system memory Optional ECC Memory Support 2 x Gigabit LAN: Intel® I219-LM and Intel® I211-AT Rich expansion interfaces with gold plated slots 6 x SATA III, 9 x USB 3.0, 6 x USB 2.0, 6 x COM Supports SATA RAID 0, 1, 5 and 10 Intel® AMT 12 TPM 2.0 Micro ATX Form Factor (9.6" x 9.6")


	MX370QD High Reliability Gold Plating Connectors LGA1151 Socket supports 8th Gen Intel® Coffee Lake Processors 2 x SO-DIMM support up to 32 GB DDR4 2400 MHz system memory Rich Expansion Interfaces: PCIe x16, M.2 Type M and Type A/E Supports Triple Display via 1 x HDMI, 2 x DP and/or LVDS 4 x USB 3.1 Gen 1 4 x USB 3.1 Gen 2 1 x USB 3.1 Gen 2 Type-C 2 x USB 2.0 2 x COM Ports, 2 x SATA III Supports TPM 2.0 mini-ITX Form Factor (6.7" x 6.7")

	ECM-CFS Supports Intel® Coffee Lake Low power LGA 6+2, 4+2 (35W) Processor 1 x 260-pin DDR4 SO-DIMM socket, supports up to 16GB DDR4 2400/2666 (non-ECC) system memory Supports Triple Display 18/24-bit dual channel LVDS, 2 x HDMI 2 x SATA III, 1 x Mini PCIe, 4 x USB 3.1 (10Gbps & compatible with USB 3.0), 2 x USB 2.0, 2 x COM, 8-bit GPIO HD Audio, Dual Gigabit Ethernet TPM 2.0 (Optional) 3.5" Single Board Computer (3.5" SBC) (5.7" x 4")

For more information please contact us at BCMSales@bcmcom.com or visit us at www.bcmcom.com.

Member of the Intel® Internet of Things Solutions Alliance

BCM is an associate member of Intel IoT Alliances. This membership opens a wide door for BCM to align closely with Intel® to better serve our clients in their use and adoption of Intel® embedded architecture. As an Intel® Internet of Things Solutions Alliance Associate member, BCM stays technologically connected through in receiving early access to the latest Intel® technical roadmaps, test platforms, design support, and business objectives. Additionally, our R&D engineers and account managers will be in a position to better serve our clients by further educating themselves about the latest Intel® embedded technologies and by actively participating in Intel® training, market development programs, and other ecosystem activities.