COMe Module
BCM Advanced Research, a supplier of embedded motherboards and intelligent systems
BCM Advanced Research
Delivering Quality Intelligent Computing Systems
6th Gen Intel® Core™ SoC ULT Processor i7/i5/i3 Type6 Compact COMe Module
Product Features
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  • Onboard 6th Gen Intel® Core™ SoC ULT i7/i5/i3 BGA Processor
  • Two 260pin SODIMM DDR4 2133 SDRAM Slot up to 32GB
  • Supports Dual Channel LVDS, Display Port, VGA/HDMI
  • Optional eDP
  • 3 x SATA (6.0GB/s), 8 x USB 2.0, 4 x USB 3.0, 8-bit GPIO
  • Intel i219LM Gigabit Ethernet
  • Type 6 Rev 2.1 Pin-out
  • Supports Intel® iAMT 11.0, TPM 2.0 (Factory Optional)
  • Supports Turbo Boost Technology, vPro, Wake on LAN
ECM-SKLU, Intel Skylake Platform 3.5 Micro Module SBC

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Product Description
CPU 6th Gen Intel® Core™ i7-6600U, 2-Core, 2.6GHz processor
6th Gen Intel® Core™ i5-6300U, 2-Core, 2.4GHz processor
6th Gen Intel® Core™ i3-6100U, 2-Core, 2.3GHz processor
6th Gen Intel® Celeron® 3955U , 2-Core, 2.0GHz Processor
System Chipset SoC
System Memory 2 x 260-pin SO-DIMM DDR4 2133 SDRAM slot up to 32 GB
Expansion 8 x PCIe x1 (it restricted to 5 devices due to LAN already count as one device)
OS Support Win 10, Win 8, Win 7
I/O Chip EC ITE IT8528E
Chipset Intel® Skylake Processor integrated Graphics
Resolution HDMI: Max. resolution 4096x2160 @ 24Hz
LVDS: Max. resolution 1920x1200 @ 60Hz
VGA: Max. resolution 1920x1200 @ 60Hz
DP: Max. resolution 4096x2304 @ 60Hz
Multiple Display LVDS(eDP) + VGA(HDMI) + DDI(HDMI or DP)
LCD Interface CH7511B (eDP to LVDS)
USB 8 x USB 2.0
4 x USB 3.0
DIO 1 x 8 bit GPIO
Other 1 x LPC, 1 x I2C, 1 x SPI, 1 x SMBus
HD Codec Intel® High Definition Audio
Audio Interface
LAN Chip 1 x Intel® i219LM
Ethernet Interface 10/100/1000 Base-Tx GbE compatible
Mechanical and Environment
Power Requirement +9 (-5%)~ +19V (+5%), VSB: 5V(±5%)
ACPI Single power ATX Support S0, S3, S4, S5
ACPI 3.0 Compliant
Power Type AT/ATX
Operating Temperature -20°C ~ 80°C (-40°F ~ 176°F)
Storage Temperature -40°C ~ 85°C (-40°F ~ 185°F)
Operating Humidity 0 ~ 90% Relative Humidity, Non-condensing
Form Factor Compact COM Express Module
Dimensions (L) x (W) 3.7" x 3.7" (95mm x 95mm)
Weight 0.44 lbs (0.2kg)
Ordering Information
Part No. Description
ESM-SKLU-6600U Intel® Core i7-6600U 2.6GHz Dual Core COMe Module
ESM-SKLU-6300U Intel® Core i5-6300U 2.4GHz Dual Core COMe Module
ESM-SKLU-6100U Intel® Core i3-6100U 2.3GHz Dual Core COMe Module
EEV-EX14 COM Express Type 6 Carrier Board (uATX) for Evaluation
* All product specifications and product images are subject to change without notice. Last update: 9/18/2017

About BCM
BCM Advanced Research (BCM) is a leading developer and manufacturer of x86/ARM RISC embedded industrial motherboards and systems for ODMs and OEM that integrate computing technology into their products. We own a very strong R&D engineering team and operation department based in Southern California in order to provide prompt project develop support and instant problem solving assistance.