BCM Advanced Research, a supplier of embedded motherboards and intelligent systems
BCM Advanced Research
Delivering Quality Intelligent Computing Systems
4th Gen. Intel® Core™ i7/i5/i3 COM Express Type 6 Module with Intel® QM87 Express Chipset

The ESM-QM87 COM Express Module is designed based on the 4th generation Intel® Core™ processor family equipped with Mobile Intel QM87 chipset architecture together known as the Haswell platform. The Intel® Haswell platform is built on the 22nm process technology with 3-D tri-gate transistors delivers significant performance advancements on a smaller chip over previous architectures including improved graphics, battery life, and security. This feature enables small form factor design on a COM Express Module such as the BCM ESM-QM87 targeting thinner intelligent applications including industrial Human Machine Interface (HMI), digital signage and medical imaging equipment.

Benefits of COM Express Module Form Factor
COM Express is a computer-on-module (COM) form factor. It is a highly integrated and compact computer board equipped with CPU, chipsets and memory sockets. All the input, output and expansion interfaces are designed on a separate COM Express carrier board thus allowing quick custom design form factors and I/O and easy core technology hardware upgrades by replacing the COM Express module docked on the carrier board. The COM Express modular approach allows for fast design turnover reducing the system down time and quick time-to-market operation. COM Express Modules are broadly adopted by many industries including gaming, retail, industrial, medical, transportation and security. This platform is an ideal solution for applications that require stability, scalability, future expandability and quick design turnover. 
Product Features
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  • 4th Generation Intel® Core™ i7/i5/i3 Processor
  • Intel® QM87 Express Chipset
  • Dual-ch 18/24-bit LVDS, VGA, DP/HDMI/DVI
  • Optional eDP
  • Intel® High Definition Audio
  • Intel® I217LM Gigabit Ethernet
  • 7 PCIex1, 1 PCIex16
  • 4 SATA, 8 USB 2.0, 4 USB 3.0, SMBus, LPC
  • +9 ~ +19V Wide Range Power Input
  • Type 6 Pin-out
ESM-QM87, Intel Haswell COM Express Modules

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Product Description
CPU ESM-QM87-4700: Intel® Core™ i7-4700EQ, 4-Core, 2.4GHz, 6M Cache
ESM-QM87-4400: Intel® Core™ i5-4400E, 2-Core, 2.7GHz, 3M Cache
ESM-QM87-4102: Intel® Core™ i3-4102E, 2-Core, 1.6GHz, 3M Cache
System Chipset Intel® QM87 Express
System Memory Two 204-pin SODIMM Up to 16GB DDR3L 1333/1600 SDRAM
Expansion 7 PCIex1, 1 PCIex16
OS Support Win 8, Win 7, Linux, Windows Server Standard
Chipset Intel® QM87 Express Chipset Integrated
Resolution VGA Mode: 1920 x 2000 @ 60Hz
LVDS Mode: 1920 x 1200 @ 60Hz
Multiple Display VGA + LVDS + DVI (3 Independent Display)
LCD Interface Dual-channel 18/24-bit LVDS, Up to 1920 x 1200, Optional eDP 2 Lanes Up to 1920 x 1200
MIO 4 SATA (6Gb x 2, 3Gb x 2), SMbus, LPC
USB 8 x USB 2.0, 4 x USB 3.0
DIO 4-bit GPI, 4-bit GPO
HD Codec Intel® QM87 Express Integrated
Audio Interface Intel® High Definition Audio
LAN Chip Intel® I217LM Gigabit Ethernet
Ethernet Interface 10/100/1000 Base-Tx Gigabit Ethernet Compatible
Mechanical and Environment
Power Requirement +9 ~ +19V
ACPI Single Power ATX Support S0, S3, S4, S5
ACPI 3.0 Compliant
Power Type AT/ATX
Operating Temperature 0 ~ 60°C (32 ~ 140°F)
Storage Temperature -40 ~ 75°C (-40 ~ 167°F)
Operating Humidity 0 ~ 90% Relative Humidity, Non-condensing
Form Factor COM Express Modules, COMe 2.1.Type 6
Dimensions (L) x (W) 5” x 3.7” (125mm x 95mm)
Weight 0.44lbs (0.2kg)
Ordering Information
Part No. Description
ESM-QM87-4700 Intel® Core™ i7-4700EQ, 4-Core, 2.4GHz, 6M Cache
ESM-QM87-4400 Intel® Core™ i5-4400E, 2-Core, 2.7GHz, 3M Cache
ESM-QM87-4102 Intel® Core™ i3-4102E, 2-Core, 1.6GHz, 3M Cache
EEV-EX14 COM Express Type 6 Carrier Board for Evaluation
* All product specifications and product images are subject to change without notice. Last update: 03/17/2015

About BCM
BCM Advanced Research (BCM) is a leading developer and manufacturer of x86/ARM RISC embedded industrial motherboards and systems for ODMs and OEM that integrate computing technology into their products. We own a very strong R&D engineering team and operation department based in Southern California in order to provide prompt project develop support and instant problem solving assistance.