BCM Advanced Research, a supplier of embedded motherboards and intelligent systems
BCM Advanced Research
Delivering Quality Intelligent Computing Systems
ESM-BDW COM Express Module equipped with the 5th generation 14nm Intel® Core™ i7/i5/i3 processor family, codenamed Broadwell. The 5th Gen Intel® Core™ Platform benefits:
  • Performance: Ultra low-power package, powering space-constrained devices in more environments
  • Compatibility: Seamless upgrades from 4th generation Intel® Core™ processor platforms to help lower development costs and reduce time to market
  • Graphics: New Intel® HD Graphics delivers stunning and responsive visuals in 5th generation Intel® Core™ processors, including increased display resolution, additional codec support, and 4k support
  • Security: Excellent security and manageability features help drive down total cost and risk, protecting data and preventing malware threats.
The ESM-BDW COM Express module is an excellent solution for mobile and low power performance driven embedded applications such as hand-held test instrumentation, portable or battery operated medical devices, mobile broadcast media, portable data-comm systems, rugged fanless devices, and vehicle computer equipment.
Product Features
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  • Onboard 5th Gen Intel® Core™ SoC i7/i5/i3 BGA Processor
  • 2 x 204pin DDR3L SO-DIMM up to 8G per DIMM
  • Support Dual Channel LVDS, Display Port, HDMI, VGA, eDP(option)
  • 4 SATA (6.0GB/s)
  • 8 USB 2.0,2 USB 3.0
  • 8-bit GPIO
  • Intel 1218LM Gigabit Ethernet
  • HD Audio Interface
  • Type 6 Pin-out
ESM-BDW 5th Gen Intel® Core™ SoC Processor i7/i5/i3 Type6 COMe Compact Module

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Product Description
CPU ESM-BDW-5650: Intel Core i7-5650U CPU, 4M Cache, up to 3.20 GHz
ESM-BDW-5350: Intel Core i5-5350U CPU, 3M Cache, up to 2.90 GHz
ESM-BDW-5010: Intel Core I3-5010U CPU, 3M Cache, up to 2.10 GHz
System Chipset SoC Integrated
System Memory 2 x204-Pin DDR3L 1600MHz SO-DIMMup to 8 GB
Up to 2 DIMMs & 8GB per DIMM, total 16GB
Expansion 4 x PCIe x1
OS Support Win 8, Win 7
Chipset Intel®GT2 Integrated Graphics
Resolution HDMI:Max. resolution 4000x2000@ 25Hz
LVDS:Max. resolution 1920x1200@ 60Hz
VGA:Max. resolution 1920x1200@ 60Hz
DP:Max. resolution 3840x2160@ 60Hz
Multiple Display VGA+LVDS
LCD Interface CH7511B(eDP to LVDS)
CH7517(DP to VGA)
MIO 1 x SMBus, 1 x LPC, 1 x I2C
USB 8 x USB 2.0 and 2 x USB 3.0
DIO 1 x 8bit GPIO
Other 4 x SATA III
HD Codec SoC Integrated
Audio Interface Intel® High Definition Audio
LAN Chip Intel® I218LM Gigabit Ethernet
Ethernet Interface 10/100/1000 Base-Tx Gigabit Ethernet Compatible
Mechanical and Environment
Power Requirement +9 ~ +19V
ACPI Single Power ATX Support S0, S3, S4, S5
ACPI 3.0 Compliant
Power Type AT/ATX
Operating Temperature 0 ~ 60°C
Storage Temperature -40°C ~ 75°C
Operating Humidity 0 ~ 90% Relative Humidity, Non-condensing
Form Factor COM Express Modules
Dimensions (L) x (W) 3.7" x 3.7" (95mm x 95mm)
Weight TBA
Ordering Information
Part No. Description
ESM-BDW-5650 Intel Core i7-5650U CPU, 4M Cache, up to 3.20 GHz
ESM-BDW-5350 Intel Core i5-5350U CPU, 3M Cache, up to 2.90 GHz
ESM-BDW-5010 Intel Core I3-5010U CPU, 3M Cache, up to 2.10 GHz
EEV-EX14 mATX Ev. Board for COMe Type 6 A1.1
* All product specifications and product images are subject to change without notice. Last update: 03/18/15

About BCM
BCM Advanced Research (BCM) is a leading developer and manufacturer of x86/ARM RISC embedded industrial motherboards and systems for ODMs and OEM that integrate computing technology into their products. We own a very strong R&D engineering team and operation department based in Southern California in order to provide prompt project develop support and instant problem solving assistance.